Trough Wafer Cleaner Model: R-7008

描述

Machine Features:

APM (SC-1) is an alkaline solution of H₂.0₂ and NH₄.OH, through H₂O₂ Strong oxidation and the dissolution of NH₄.OH make organic contamination into water-soluble compounds, which are eliminated with deionized water washing. Due to the strong oxidizing and complexing properties of the solution, it can oxidize Cr, Cus, Zn Ag, Ni. Co. CaFe, Mg, etc. to make them into high-valent ions, and then further react with alkali to form soluble complexes, which are dissolved with deionized water. are removed by washing. For this reason, cleaning the polishing sheet with SC-1 solution can remove both organic contamination and certain metal contamination.

DHF can remove the natural oxide film on the surface of the silicon wafer, and the metal attached to the natural oxide film will be dissolved in the cleaning solution, which can remove Al, Fe, Zn, Ni and other metals on the surface of the silicon wafer. DHF can also remove metal hydroxide attached to the natural oxide film. When cleaning with DHF, the natural oxide film is corroded, and the silicon on the surface of the silicon wafer is hardly corroded.