Photoresist cleaning machine Model: R-7018

描述

Machine Features:

The photoresist residue on the surface of the wafer is removed by SPM cleaning. SPM has a high oxidation ability, can oxidize the organic matter of the photoresist to generate CO₂ and H₂ 0 and can also dissolve the metal into the cleaning solution after oxidation. Main process flow: SPM pickling, QDR rinsing, ultrasonic cleaning, overflow rinsing