How to solve the problem of PAD lifting by Conductive adhesive ?

This is a maintenance program for the product PAD lifting, which can restore the products that need to be scrapped to the original circuit functions, especially the PAD upturn can be repaired due to careless maintenance. However, the problem that the line through the hole and the line completely disconnected is not within the scope of this scheme.

Conductive adhesive operation specification

1. Purpose

Proper storage and proper PCBA repair of conductive adhesive .

2. Scope of application

This conductive adhesive is suitable for all defective products of the company’s PCBA copper foil lift up.

3. Storage of conductive adhesive.

The temperature of the storage cabinet (refrigerator) of conductive adhesive is: 0 ° C or less.

4. How to use conductive adhesive:

4.1 After the conductive adhesive is taken out, it should be placed at room temperature and returned to warm temperature for 20-35 minutes.

4.2. Clean the product which need to be processed.

4.3. Put the glue into the underside of the copper foil (determine the amount of conductive glue according to the size of the copper foil) and stick the copper foil.

Note: To maintain the flatness of the copper foil during bonding, remove excess conductive adhesive to keep the PCBA clean.

4.4. Heat curing: The repaired PCBA needs to be placed in the oven for baking.

Standard baking conditions: 130 ° C – 150 ° C / 60 Min

4.5 After the curing is completed, measure the electrical performance to confirm whether the repair is OK.

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